PCB DEWETTING

ELECTRONIC PROBLEM, FAIL, ISSUES, DEFECT : PCB, PWB, REFLOW, DELAMINATION, DEWETTING, INTERMETALLIC, IONIC CONTAMINATION, BGA, SEM, FTIR, XPS, TGA, ATC, LEAD FREE, GOLD, ENIG, SILVER, OSP, TIN, BLACK PAD, VOID, SAC, ROHS.

How many times have you had a problem with a PCB or Assembly, for example, a DELAMINATION or a DEWETTING (poor solderability) and you do not know what to do?

Have you tried to seek answers to the Internet and have spent hours and hours, and you've lost in a sea of informations.

Have you bought many books, spending thousands of dollars, have you read hundreds of pages, finding only graphics and tables absolutely useless, absolutely theoretical formulas, all of them, but not the answer you were looking for.

Now there ARE TWO QUICK HANDBOOKs,

TWO easy guide, to :

failure analysis of pcb

(more than 180 pages)

AND

failure analysis of PCB ASSEMBLY

(more than 220 pages)

THE QUESTIONS ARE :

WHERE is located the fault ?
how has been determined ?
what is the failure mode ?
what they have been the first cause ?


The confirms of the correctness of answers to these questions must always come from laboratory tests.

And while I do this :

WHICH TOOL should I use ?
WHICH TEST should I choose ?

What you will learn:

The objective of these HANDBOOKs is to prepare the readers to make informed decisions when a PCB or Assembly problem exist.

Who will it benefit:

The skills learned in these HANDBOOKs are beneficial to materials and process engineers, quality control engineers, failure analysis engineers and manufacturing engineers.

Visit our official website : www.analysispcb.com,

and download the two
FREE DEMO BOOKs.

Contact us at our e-mail
analysispcb@gmail.com

ALL IN ONE.

THESE HANDBOOKs ARE A SYNTHESIS OF MORE THAN 5,000 PAGES OF REPORT OF FAILURE ANALYSIS, IN JUST 200 PAGES.